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Micro SD card connector push push,H1.85mm,with CD pin
Material:
Insulator: High Temperature Thermoplastic,UL94V-0.
Contact: Copper Alloy T=0.15,Plated 50u" Ni Overall.
Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area.
Shell: T=0.15,Plated 30u" Ni Overall min. Plated 0.5u" Au Selective Contact Area
Electrical:
Current Rating: 0.5 A
Voltage Rating: 3.3V
Ambient Humidity Range: 95% R.H. Max.
Contact Resistance: 100mΩ Max.
Insulation Resistance: 1000MΩ Min./500VDC
Mating Cycles: 5000 Insertions.
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